WEP 946D IV 100x50mm Small LED Soldering Hot Plate for SMD BGA Smartphone Microcomputer Rework Reflow, 210W Preheater Station with ℃/℉ Digital Temperature Control

About this item

• This compact soldering hot plate comes with built-in temperature control (PID Program/Cycles in milliseconds), with adjustable temperature range from 122°F~752°F; Supports soldering or rework applications on SMD components such as LED diodes, BGA chips, and more without concern on overheating
• The reflow hotplate is made from quality aluminum with 3.94x1.97inches (100x50mm) effective heating area, the heating plate is protected with metallic guards
• Can be used in conjunction with hot air rework station or soldering station to remove BGA chips by applying heat from the top and bottom
• Features °C - °F conversion function, and a digital read-out for easy real-time temperature reference
• Commonly used for SMD components soldering, phone screen preheat, glue removal, and other heating applications
• Exclusive Technical Support: This soldering hot plate is covered by our exclusive 1-year USA technical support, with 24-hour assistance from our dedicated team; WEP offers affordable range of compatible replacements; Note: This product is rated for 110-127V USA specifications; Do not connect this iron to a 220V power socket