Product Information
Availability
In Stock
Seller
ARCTIC Inc
About this item
- HIGH-PERFORMANCE THERMAL CONDUCTIVITY WITH TP-4:Ultra-soft silicone-based pad outperforms many high-end alternatives, ensuring excellent heat transfer even across uneven chip surfaces.
- OPTIMAL COMPRESSION FOR LOWER THERMAL RESISTANCE:Highly compressible material (e.g. 0.5 mm to 0.3 mm) minimizes thermal resistance and compensates height differences up to 40%.
- PERFECT GAP FILLING PERFORMANCE:Adapts seamlessly to uneven surfaces and air gaps, providing reliable contact without stressing sensitive components.
- VERSATILE APPLICATION ACROSS DEVICES:Ideal for RAM, GPUs, laptops, consoles, M.2 SSDs, and various electronic components requiring efficient thermal management.
- SAFE AND USER-FRIENDLY DESIGN:Electrically insulating, non-adhesive, and vibration-dampening for secure handling and long-term reliability.
