T-937 2300W Lead-Free Reflow Oven, Infrared IC Heater Soldering Machine for BGA SMD SMT PCB Rework, Desktop Bench Top

About this item

• Infrared Heating with Hot Air Circulation - A powerful infrared emission combined with circulating hot air keeps the temperature accurate and evenly distributed, delivering reliable soldering results for SMD and BGA boards.
• 306 x 322 mm Soldering Area - Generous work space accepts small to medium PCB assemblies for prototypes, engineering models, repairs and low-volume production.
• Windowed Drawer Design - Slide the drawer out to load and inspect the PCB safely during soldering; convenient manipulation of SMD/BGA components mounted on the board.
• Microprocessor Controlled Cycles - Automatic soldering from preheat to reflow, with temperature adjustable from room temperature up to 350 degree C and cycle time of 2-16 minutes.
• Multi-Purpose Rework Tool - Correct bad solder joints, remove and replace defective components, or complete small engineering models and prototypes with one machine.