Product Information
About
[DEVICE COMPATIBILITY] Specifically designed for A60-A90 series, SDM450, and MT6762 CPUs to ensure perfect alignment and prevent solder bridging during reballing. The precise 0.12mm spacing matches exact CPU specifications for professional-grade results.
[MATERIAL QUALITY] Made from high-grade 304 stainless steel that withstands 400°C temperatures without warping or deformation. The cut holes maintain perfect geometry through repeated use, ensuring consistent solder ball deposition every time.
[PRECISION ENGINEERING] Features specialized IC slots that prevent tin sticking and corner damage during rework. The 0.12mm thickness delivers optimal solder paste volume for reliable connections without bridges or shorts.
[WORKFLOW EFFICIENCY] Enables rapid tinning with accurate positioning that saves 50% rework time compared to universal stencils. The lightweight design (45g) fits all standard soldering stations while remaining portable for mobile repair jobs.
[VERSATILE APPLICATION] Compatible with multiple phone including A10S, A605F, A705F and A920F. The reinforced edges prevent bending during handling, making it ideal for both shop technicians and field repair specialists.
