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Mixed Size Heat Sinks Combination Kit The kit includes 10 pieces copper heatsinks in 5 different thicknesses and 10 silicone pads - total 60 pieces heat dissipation material - to meet the diverse needs of different electronic devices.
COPPER HEATSINK The copper heatsink is made of pure copper with thermal conductivity up to 401W/mK. It is available in five thicknesses from 0.3 mm to 1.2 mm (standard size 20 × 20 mm) for fast and efficient heat dissipation.
SILICONE HEAT CONDUCTIVE PADS The set contains 1mm thick flexible silicone pads with good thermal conductivity and easy adhesion. These pads can be easily cut to fit different chip sizes and fill gaps in the cooling system.
Electronic Device Compatibility The heatsink is suitable for heat management of various electronic components, including development boards, CPUs, GPUs, VGAs, RAM, VRAM, VRMs, IC chips and M.2 NVMe SSDs.
EASY INSTALLATION Thanks to its lightweight design and standard pre-cut dimensions, installing the heatsink is easy and fast. A storage box for easy sorting and storage is included and allows convenient access and more efficient maintenance.

Product Description

Item Type:Heatsink Product Model: HMT60 Product material: copper, silicone. Thermal conductivity of copper: 401 W/mK Product specification: (approx.) Pack of 10 copper pads 20 x 20 x 0.3 mm / 0.79 x 0.79 x 0.01 inches. Pack of 10 copper pads 20 x 20 x 0.5 mm / 0.79 x 0.79 x 0.02 inches. Pack of 10 copper pads 20 x 20 x 0.8 mm / 0.79 x 0.79 x 0.03 inches. Pack of 10 copper pads 20 x 20 x 1 mm / 0.79 x 0.79 x 0.04 inches. Pack of 10 copper pads 20 x 20 x 1.2 mm / 0.79 x 0.79 x 0.05 inches. Pack of 10 20 x 20 x 1 mm / silicone pad (0.79 x 0.79 x 0.04 inches). Function: Used to fill gaps in PC component cooling Package includes: 50 x copper pads. 10 x silicone pads. 1 x storage box.

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